Full Description

This document defines

1. a default method for those companies that require a pre-defined approach and

2. a protocol for those companies that wish to develop their own test methods.

This document addresses the evaluation of failure mechanisms, through performance testing, expected in electronic products containing Pb-free solder. One failure mode, fatigue-failure through the solder-joint, is considered a primary failure mode in AHP electronics and can be understood in terms of physics-of-failure and life-projections. Understanding the all potential failure modes caused by Pb-free solder of AHP electronics is a critical element in defining early field-failures/reliability issues. Grouping of different failure modes may result in incorrect and/or misleading test conclusions. Failure analysis efforts should be conducted to insure that individual failure modes are identified enabling the correct application of reliability assessments and life projection efforts.

Product Details

Published: 12/01/2012 ANSI: ANSI Approved Number of Pages: 56