New TechAmerica GEB-0002 View larger

TechAmerica GEB-0002

M00010500

New product

TechAmerica GEB-0002 GEIA Engineering Bulletin: Reducing the Risk of Tin Whisker-Induced Failures in Electronic Equipment

standard by TechAmerica, Where the Future Begins (formerly ITAA/GEIA), 11/01/2003

More details

In stock

$0.00

More info

Full Description

This Bulletin provides a brief description of tin whisker formation and describes various methods recommended by government and industry to reduce the risk of tin whisker-induced failures in electronic hardware. It is not a mandate nor does it contain any requirements.

A tin whisker is a single crystal that emerges from tin-finished surfaces. Tin whiskers can pose a serious reliability risk to electronic assemblies that have pure tin finish. The general risks fall into several categories: short circuits, low-pressure-induced metal vapor arcing (plasma) and debris/contamination.