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TechAmerica EIA-SSB-1.001
M00010521
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TechAmerica EIA-SSB-1.001 GEIA Engineering Bulletin: Qualification and Reliability Monitors
standard by TechAmerica, Where the Future Begins (formerly ITAA/GEIA), 11/01/1999
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This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace, and other Rugged Applications (the latest revision).The scope of this document is to establish the recommended minimum qualification and monitoring testing of plastic encapsulated microcircuits and discrete semiconductors suitable for potential use in many rugged, military, severe, or other environments.