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TechAmerica EIA-SSB-1.002
M00010522
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TechAmerica EIA-SSB-1.002 GEIA Engineering Bulletin: Environmental Tests and Associated Failure Mechanisms
standard by TechAmerica, Where the Future Begins (formerly ITAA/GEIA), 10/01/1999
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This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace, and other Rugged Applications (the latest revision).This document provides reference information concerning the environmental stresses associated with tests specifically designed to apply to (or have unique implications for) plastic encapsulated microcircuits and semiconductors, and the specific failures induced by these environmental stresses.