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The electronic assembly industry has already experienced how strong the force of environmental compliance can be when it was mandated to move away from ozone depleting chemistries typically used in solvent cleaning of final soldered assemblies. In actuality, the force of environmental compliance is just beginning to flex its muscle. This paper explores the growing movement towards the greening of the electronic assembly process, elimination of aqueous or semi-aqueous final cleaning, the removal of volatile organic compound (VOC) from flux chemistries, as well as the current status of lead-free alloys. As pressure becomes greater to emit less pollutants, the companies that accept and implement an environmentally friendly strategy early on will find a path of least resistance in the future.

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Published: 11/01/2000 Number of Pages: 7 File Size: 1 file , 420 KB