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SME MS00-240

M00013347

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SME MS00-240 Fuzzy Logic Connectivity In Semiconductor Defect Clustering

standard by Society of Manufacturing Engineers, 11/01/2000

Thomas P. Karnowski ; Shaun S. Gleason ; Kenneth W. Tobin, Jr.

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In joining defects on semiconductor wafer maps into clusters, it is common for defects caused by different sources to overlap. Morphological image processing joins too many unrelated defects together or not enough. Capturing the human thought process which connects these defects into clusters is ideally suited for fuzzy logic. A system of rules was developed to join disconnected clusters based on properties such as elongation, orientation, and distance. Clusters are joined or not joined based fuzzy rules illustrated here. The fuzzy membership functions, the techniques used to measure the features, and methods for improving the speed of the system are all developed. Examples are shown using real-world semiconductor wafer maps.