Full Description

1.1This specification is designed to evaluate adhesives suitable for the bonding of oriented strand board (OSB) to rigid cellular polystyrene insulation core materials for general structure use.

1.2The requirements of the structural insulated panel (SIP) adhesive are based on the performance of the adhesive as measured by:

1.2.1Resistance to shear by compression loading in ambient conditions and after accelerated aging.

1.2.2Resistance to tensile loading in ambient conditions and after accelerated aging.

1.2.3Resistance to creep (deformation) under static load in ambient conditions and after accelerated aging.

1.2.4Tensile and shear strength to polystyrene core materials.

1.3The classification of the adhesive formulation is based on, but not limited to the adhesives industry accepted generic names, for example: phenol-resorcinol, emulsion polymer isocyanate, one and two-part urethane. The type of adhesive application and curing terminology are also usually included for classification purposes such as cold-setting phenol resorcinol, heat-cured phenol resorcinol, and hot melt one component urethane.

1.4Evaluation of adhesive performance at high temperature conditions, such as during a fire exposure, is beyond the scope of this specification.

1.5The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.

1.6This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

1.7This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.