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BS EN 61191-3:2017
M00002593
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25 September 2017 Printed board assemblies. Sectional specification. Requirements for through-hole mount soldered assemblies
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Boards, Wires, Holes, Soldering, Printed circuits, Joints, Electrical components, Printed-circuit boards, Defects, Microassembling, Electrical equipment, Surface properties, Electronic equipment and components, Integrated circuits, Semiconductor devices