M00002952
New product
05 September 2017 BS IEC 62047-31. Semiconductor devices. Micro-electromechanical devices. Part 31. Four-point bending test method for interfacial adhesion energy of layered MEMS materials
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Availability date: 07/12/2021
Defects, Optical recording, Testing conditions, Storage, Optical disks, Data recording, Computer storage devices, Data media, Dimensions, Read-only storage, Environment (working), Data processing, Error correction, Data transmission, Recording tracks, Information exchange, Coding (data conversion), Optical properties of materials, Recording characteristics, Digital signals, Data transfer, Data layout, CD-ROM