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BS EN IEC 61249-2-46:2018

M00000342

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16 April 2018 Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

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$76.50

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$170.00

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Testing, Copper (I) compounds, Printed-circuit boards, Circuits, Printed circuits