M00000342
New product
16 April 2018 Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
In stock
Warning: Last items in stock!
Availability date: 07/12/2021
Testing, Copper (I) compounds, Printed-circuit boards, Circuits, Printed circuits