M00001704
New product
30 November 2016 Semiconductor devices. Micro-electromechanical devices. Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength of micro bonding area
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Availability date: 07/12/2021
Semiconductor technology, Integrated circuits, Electronic equipment and components, Resonance, Electromechanical devices, Thin-film devices, Bend testing, Vibration, Test specimens, Fatigue testing, Test equipment, Semiconductor devices