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BS EN 62047-25:2016

M00001704

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30 November 2016 Semiconductor devices. Micro-electromechanical devices. Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength of micro bonding area

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$76.50

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$170.00

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Semiconductor technology, Integrated circuits, Electronic equipment and components, Resonance, Electromechanical devices, Thin-film devices, Bend testing, Vibration, Test specimens, Fatigue testing, Test equipment, Semiconductor devices