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BS EN IEC 61190-1-3:2018
M00000589
New product
28 March 2018 Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
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Electronic equipment and components, Electronic engineering, Quality control, Bars (materials), Classification systems, Soldering, Fluxes (materials), Particulate materials, Bonding, Quality assurance, Test methods, Pastes, Electrical connections, Solders