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BS 4584-103.1:1990, IEC 60249-3-1:1981
M00000240
New product
28 February 1990 Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits. Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board
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Printed-circuit bases, Printed-circuit boards, Printed circuits, Impregnated materials, Epoxy resins, Reinforced materials, Textile glass, Woven fabrics, Laminates, Sheet materials, Bonding, Defects, Flammability, Permittivity, Dissipation factor, Dielectric strength, Rolls, Packaging, Marking, Sample location, Volatile matter determination, Determination of content, Specimen preparation, Testing conditions, Heating tests, Flow measurement, Test specimens, Thickness measurement, Gelation, Time measurement, Flameproof materials