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BS EN IEC 61760-3:2021

M00000527

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18 March 2021 Surface mounting technology. Standard method for the specification of components for through-hole reflow (THR) soldering

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Marking, Integrated circuits, Electronic equipment and components, Packaging, Soldering, Integrated circuit technology, Holes, Surface mounting devices, Solderability testing, Microassembling, Cleaning, Electrical components