M00000244
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ISO 9453 3rd Edition, August 1, 2014 Soft solder alloys - Chemical compositions and forms
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Availability date: 07/13/2021
Description / Abstract:
WARNING — National or regional regulations may limit the
employment of certain alloys.
This International Standard specifies the requirements for
chemical composition for soft solder alloys containing two or more
of tin, lead, antimony, copper, silver, bismuth, zinc, indium
and/or cadmium.
An indication of the forms generally available is also
included.